| FR4 Copper Clad Laminate | |
| 1.Material | composite polymer(flame-retardant epoxy resin, E-glass fiber cloth with copper as cladding) |
| 2.Technics | Mixing, Coating, Folding, Laminated, Retum Line, Cutting, Packing |
| 3.Color | natural color(light green), yellow, and black or as per customer's requirement |
| 4.Measurement | 1020 x 1220mm |
| 5.Feature | Lead Free, Flame retardant, thermal reliability, lower warpage |
| 6.Using scope | Suitable for high-count layer PCB, computer, communication equipment, OA equipment, lead-free PCB process, etc. |
| 7.Packing | carton packaging / 250 sheet per pallet |
| 8.Certification | ISO9001, ISO14001, CQC, UL |
| 9.Payment | T/T, L/C, Western Union, USD |
| 10.Technological requirements | For your choices |
| Item | Test condition | Unit | Spec | Typical Value | |
| Tg | DSC | ℃ | ≥170 | 175.2 | |
| Peel strength (1OZ) |
288℃, 10S | N/mm | ≥1.05 | 1.41 | |
| Thermal Stree | 288℃, 10S/solder dip | - | No delamination | 180S/No delamination | |
| Flammability | N/㎟ | LW | ≥415 | 580 | |
| CW | ≥345 | 482 | |||
| Surface Resistivity |
After moisture | MΩ | ≥1.0x104 | 2.52x107 | |
| Volume Resistivity |
After moisture | MΩ.cm | ≥1.0x105 | 3.21x108 | |
| Dielectric Constant |
1MHz C-24/23/50 | - | ≤5.4 | 4.7 | |
| Loss Tangent | 1MHz C-24/23/50 | - | ≤0.035 | 0.016 | |
| Arc Resistivity | D-48/50+D-0.5/23 | S | ≥60 | 122 | |
| Dielectric Breakdown |
D-48/50+D-0.5/23 | KV | ≥40 | 58 | |
| Moisture Absorption |
D-24/23 | % | ≤0.5 | 0.1 | |
| Td | Weight loss 5% | ℃ | 340 | 347 | |
| CTE Z-axis |
Alpha 1 | TMA | ppm/℃ | ≤60 | 45 |
| Alpha 2 | ppm/℃ | ≤300 | 170 | ||
| 50-260℃ | % | ≤3.0 | 2.9 | ||
| T288 | TMA | min | ≥15 | 30 | |
| CTI | IEC60112 Methed | V | 175~250 (Grade 3) |
200 | |